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  • Report  |  Key: 11191  |  ID: 0516-00000-O-3DL-100  |   Published: 30 December 2016
    The DesignLook report provides an overview of a semiconductor device and features a die floorplan along with details of the process and package. The report includes photographs of the package, die and... ~ (Similar Results)
  • Report  |  Key: 10937  |  ID: 1215-38729-O-4PE-100  |   Published: 26 February 2016
    This process essentials report provides an overview of the structure and materials used by UMC to fabricate the 40 nm node Xilinx Virtex-6 FPGA. The XC6VLX130 is fabricated using a 9 metal (8-Cu, 1-Al),... ~ (Similar Results)