• Intel 3D XPoint

  • 3D XPoint technology was unveiled by Intel and Micron in August 2015, creating the first new memory category in more than 25 years. When Intel announced the Optane brand for storage products based on 3D XPoint technology, it would first come to market in a new line of high-endurance, high-performance Intel SSDs beginning in 2016.

    XPoint, a phase change memory (PCM) from TechInsights materials analysis, is a non-volatile memory (NVM) technology. Bit storage is based on a change of bulk resistance, in conjunction with a stackable cross-gridded data access array. Price is intended to be less than dynamic random-access memory (DRAM) but more than flash memory.

    We have started our analysis on the Intel 3D XPoint.

    Two Advanced CMOS Essentials (ACE) Reports

    The ACE deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors

    Structural Analysis (DSA)

    Our Structural Analysis report provides industry leading structural analysis of state-of-the-art memories.

    Process Flow Analysis

    Process flows are reconstructed from images and material analyses in our ACMOS ACE report database.

    Transistor Characterization Report (TCR)

    Our transistor characteristics reports provide analysis on the DC electrical properties of the logic NMOS and PMOS transistors.

    Circuit Analysis

    The report contains a full set of schematics and annotated photographs divided into the following sections (Architectural Overview, Memory Array and Peripherals, Address Path, Data Path, Control Blocks, Voltage Generator System, Symbol Definitions, Major Findings, Standard Cells, Signal List)

    This product brief summarizes the deliverables that we intend to build as well as some additional commentary on the technological relevance of the part.

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  • Intel 3D XPoint Memory Die Removed from Intel OptaneTM PCM (Phase Change Memory)

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