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SmartSens SC130GS Global Shutter CIS Device Essentials Plus Folder

Report | Key: DEP-1806-801 | ID: DEP-1806-801 | Published: 12 September 2018

The Device Essentials Plus (DEP) deliverable builds on the content generated in a Device Essentials (DEF) project. The goal of a DEP is to extend coverage beyond the SEM-based imaging used for DEF projects,... ~ (Similar Results)
Quick Survey Teardown of the Huawei Honor Play COR-AL00 Smartphone

Report | Key: QST-1806-818 | ID: QST-1806-818 | Published: 11 September 2018

The Bill of Materials files are Excel files that contain all of the costing materials gathered during the physical teardown and analysis of the device. This information is broken up into several tabs... ~ (Similar Results)
Survey Plus Teardown of the Samsung Galaxy A6+ SM-A605FN/DS Smartphone

Report | Key: SPT-1806-807 | ID: SPT-1806-807 | Published: 11 September 2018

Product Type Smartphone Brand Samsung Device Name Galaxy A6+ Device Model # SM-A605FN/DS Official Release Date 02/05/2018 ... ~ (Similar Results)
AMD Ryzen 7 2700X (9500A Die) GLOBALFOUNDRIES 12LP Process ACMOS Essentials

Report | Key: ACE-1806-801 | ID: ACE-1806-801 | Published: 11 September 2018

The Advanced CMOS Essentials (ACE) deliverable for logic microprocessor chips with FinFETs comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features... ~ (Similar Results)
Intel i3-8121U Cannon Lake Intel 10 nm FinFET Process Advanced CMOS Essentials - Part 2

Report | Key: ACE-1805-804 | ID: ACE-1805-804 | Published: 11 September 2018

The Advanced CMOS Essentials (ACE) deliverable comprises a concise analyst summary of critical device metrics, TEM-EDS, TEM-EELS results, and salient features supported by the following image folders:... ~ (Similar Results)
Quick Survey Teardown of the Samsung Galaxy A6+ SM-A605FN/DS Smartphone

Report | Key: QST-1806-809 | ID: QST-1806-809 | Published: 11 September 2018

The Bill of Materials files are Excel files that contain all of the costing materials gathered during the physical teardown and analysis of the device. This information is broken up into several tabs... ~ (Similar Results)
Survey Plus Teardown of the Huawei Honor Play COR-AL00 Smartphone

Report | Key: SPT-1806-809 | ID: SPT-1806-809 | Published: 11 September 2018

Product Type Smartphone Brand Huawei Device Name Honor Play Device Model # COR-AL00 Official Release Date 06/06/2018 ... ~ (Similar Results)
Avago DFI FBAR Filter from the Apple iPhone 7 MEMS Process and Circuit Analysis

Report | Key: CWR-1808-801 | ID: CWR-1808-801 | Published: 10 September 2018

This report presents a MEMS Process and Circuit Analysis of the Avago DFI FBAR filter extracted from the Apple iPhone 7. The analysis includes the results of a full circuit analysis of the Avago DFI FBAR... ~ (Similar Results)
MediaTek MT6771V Helio P60 TSMC 12FFC FinFET ACMOS Essentials

Report | Key: ACE-1804-801 | ID: ACE-1804-801 | Published: 7 September 2018

The Advanced CMOS Essentials (ACE) deliverable for logic microprocessor chips with FinFETs comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features... ~ (Similar Results)
MicroVision-STMicroelectronics PM54A MEMS Die from the MicroVision PB0133286-005 and PB0134474-001 Micromirror Modules

Report | Key: EXR-1808-803 | ID: EXR-1808-803 | Published: 4 September 2018

This report presents an Exploratory Analysis on the STMicroelectronics PM54A MEMS die contained in the MicroVision PB0133286-005 and PB0134474-001 micromirror modules from the Sony MP-CL1A laser projector and the Ragentek VOGA V 55909 smartphone. ~ (Similar Results)

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