Ray Fontaine is a Senior Technical Analyst specializing in semiconductor fabrication process analysis and image sensors at TechInsights. While earning a B.A.S.E.E.T. degree he worked at Sony USA before moving on to Intel and then Integrated Circuit Engineering (ICE) Corporation, which was acquired by Chipworks in 2001. As a senior member of Chipworks’ Competitive Technical Intelligence (CTI) group Mr. Fontaine managed its image sensors subscription service, regularly authored technical reports and visited product and engineering teams to present image sensor technical trend analyses. Chipworks merged with TechInsights in June 2016 and Mr. Fontaine continues in an equivalent role within TechInsights’ Technology Intelligence business unit.
We asked Ray Fontaine, Senior Technical Analyst specializing in semiconductor fabrication process analysis and image sensors, for his thoughts on the most interesting developments in image sensor technology in 2017.
These structures are critical to the performance of 1.0 µm to 1.4 µm generation pixels in smartphone cameras.
Work on the IMX400 project continues and we look forward to publishing our report in a few weeks. Enjoy Part 2, where we discuss the trends in wafer-to-wafer interconnect and other features of stacked chips.
This year’s IISW marked the 10th anniversary of this biennial conference and corresponded to the 10th anniversary of TechInsights’ presence at the workshop.
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